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| Freescale Semiconductor Technical Data MPXV4115V Rev 2, 05/2005 Integrated Silicon Pressure Sensor On-Chip Signal Conditioned, Temperature Compensated, and Calibrated The MPXV4115V series piezoresistive transducer is a state-of-the-art monolithic silicon pressure sensor designed for a wide range of applications, particularly those employing a microcontroller with A/D inputs. This transducer combines advanced micromachining techniques, thin-film metallization and bipolar processing to provide an accurate, high-level analog output signal that is proportional to the applied pressure/vacuum. The small form factor and high reliability of on-chip integration make the sensor a logical and economical choice for the automotive system designer. Figure 1 shows a block diagram of the internal circuitry integrated on a pressure sensor chip. Features * * * * 1.5% Maximum error over 0 to 85C Temperature Compensated from -40 + 125C Ideally Suited for Microprocessor or Microcontroller-Based Systems Durable Thermoplastic (PPS) Surface Mount Package MPXV4115V SERIES INTEGRATED PRESSURE SENSOR -115 to 0 kPa (-16.7 to 2.2 psi) 0.2 to 4.6 V OUTPUT SMALL OUTLINE PACKAGE MPXV4115V6U/6T1 CASE 482-01 Typical Applications * * Vacuum Pump Monitoring Brake Booster Monitoring The MPXV4115V series pressure sensors are available in the basic element package or with a pressure port. Two packing options are also offered. ORDERING INFORMATION Device Type Case No. MPX Series Order No. Packing Options Device Marking MPXV4115VC6U CASE 482A-01 SMALL OUTLINE PACKAGE (MPXV4115V SERIES) Basic Elements Ported Elements 482 482 482A MPXV4115V6U MPXV4115V6T1 MPXV4115VC6U Rails Tape & Reel Rails MPXV4115V MPXV4115V MPXV4115V 1 2 3 4 PIN NUMBER(1) N/C VS GND VOUT 5 6 7 8 N/C N/C N/C N/C 1. Pins 1, 5, 6, 7, and 8 are internal device connections. Do not connect to external circuitry or ground. Pin 1 is noted by the notch in the lead. (c) Freescale Semiconductor, Inc., 2005. All rights reserved. VS Sensing Element Thin Film Temperature Compensation and Gain Stage #1 Gain Stage #2 and Ground Reference Shift Circuitry Vout GND Pins 1, 5, 6, 7 and 8 are NO CONNECTS For Small Outline Package Device Figure 1. Fully Integrated Pressure Sensor Schematic Table 1. Maximum Ratings(1) Rating Maximum Pressure Storage Temperature Operating Temperature Symbol Pmax Tstg TA Value 400 -40 to +125 -40 to +125 Unit kPa C C 1. Exposure beyond the specified limits may cause permanent damage or degradation to the device. MPXV4115V 2 Sensors Freescale Semiconductor Table 2. Operating Characteristics (VS = 5 Vdc, TA = 25C unless otherwise noted. Decoupling circuit shown in Figure 3 required to meet electrical specifications.) Characteristic Pressure Range (Differential mode, Vacuum on metal cap side, Atmospheric pressure on back side) Supply Voltage(1) Supply Current Full Scale Output(2) (Pdiff = 0 kPa)2 Full Scale Span(3) @ VS = 5.0 V Accuracy(4) Sensitivity Response Time(5) Output Source Current at Full Scale Output Warm-Up Time(6) Offset Stability(7) 1. Device is ratiometric within this specified excitation range. 2. Full Scale Output is defined as the output voltage at the maximum or full-rated pressure. 3. Full Scale Span is defined as the algebraic difference between the output voltage at full-rated pressure and the output voltage at the minimum-rated pressure. 4. Accuracy is the deviation in actual output from nominal output over the entire pressure range and temperature range as a percent of span at 25C due to all sources of errors, including the following: * Linearity: Output deviation from a straight line relationship with pressure over the specified pressure range. * Temperature Hysteresis: Output deviation at any temperature within the operating temperature range, after the temperature is cycled to and from the minimum or maximum operating temperature points, with zero differential pressure applied. * Pressure Hysteresis: Output deviation at any pressure within the specified range, when this pressure is cycled to and from minimum or maximum rated pressure at 25C. * TcSpan: Output deviation over the temperature range of 0 to 85C, relative to 25C. * TcOffset: Output deviation with minimum pressure applied, over the temperature range of 0 to 85C, relative to 25C. 5. Response Time is defined as the time for the incremental change in the output to go from 10% to 90% of its final value when subjected to a specified step change in pressure. 6. Warm-up Time is defined as the time required for the product to meet the specified output voltage after the Pressure has been stabilized. 7. Offset Stability is the product's output deviation when subjected to 1000 hours of Pulsed Pressure, Temperature Cycling with Bias Test. (0 to 85C) VFSS -- 4.4 -- Vdc (0 to 85C) Symbol POP VS Io VFSO Min -115 4.75 -- 4.535 Typ -- 5.0 6.0 4.6 Max 0 5.25 10 4.665 Unit kPa Vdc mAdc Vdc (0 to 85C) -- V/P tR Io -- -- -- -- -- -- -- -- -- 38.26 1.0 0.1 20 0.5 1.5% -- -- -- -- -- %VFSS mV/kPa ms mAdc ms %VFSS MPXV4115V Sensors Freescale Semiconductor 3 ON-CHIP TEMPERATURE COMPENSATION, CALIBRATION, AND SIGNAL CONDITIONING The performance over temperature is achieved by integrating the shear-stress strain gauge, temperature compensation, calibration and signal conditioning circuitry onto a single monolithic chip. Figure 2 illustrates the gauge configuration in the basic chip carrier (Case 482). A fluorosilicone gel isolates the die surface and wire bonds from the environment, while allowing the pressure signal to be transmitted to the silicon diaphragm. The MPXV4115V series sensor operating characteristics are based on use of dry air as pressure media. Media, other than dry air, may have adverse effects on sensor performance and long-term reliability. Internal reliability and qualification test for dry air, and other media, are available from the factory. Contact the factory for information regarding media tolerance in your application. Figure 3 shows the recommended decoupling circuit for interfacing the output of the integrated sensor to the A/D input of a microprocessor or microcontroller. Proper decoupling of the power supply is recommended. Figure 4 shows the sensor output signal relative to differential pressure input. Typical, minimum and maximum output curves are shown for operation over a temperature range of 0C to 85C using the decoupling circuit shown in Figure 3. The output will saturate outside of the specified pressure range. Fluorosilicone Gel Die Coat P1 Wire Bond Lead Frame Die Stainless Steel Cap Thermoplastic Case +5 V Vout Vs IPS 1.0 F 0.01 F GND OUTPUT 470 pF P2 Differential Sensing Element Die Bond Figure 2. Cross-Sectional Diagram (not to scale) Figure 3. Recommended Power Supply Decoupling and Output Filtering (For additional output filtering, please refer to Application Note AN1646.) TRANSFER FUNCTION MPXV4115V 5 4.5 4 3.5 Output (V) 3 2.5 2 1.5 1 0.5 0 -115 -95 -75 -55 Vout vs. Vacuum -35 -15 MAX MIN Transfer Function: Vout = Vs*[(0.007652*P) + 0.92] Pressure error *Temp Factor*0.007652*VS) VS = 5.0 V 0.25 Vdc TEMP = 0-85C Figure 4. Applied Vacuum in kPa (below atmospheric pressure) MPXV4115V 4 Sensors Freescale Semiconductor MINIMUM RECOMMENDED FOOTPRINT FOR SURFACE MOUNTED APPLICATIONS Surface mount board layout is a critical portion of the total design. The footprint for the surface mount packages must be the correct size to ensure proper solder connection interface between the board and the package. With the correct footprint, the packages will self align when subjected to a solder reflow process. It is always recommended to design boards with a solder mask layer to avoid bridging and shorting between solder pads. 0.660 16.76 0.100 TYP 8X 2.54 0.060 TYP 8X 1.52 0.300 7.62 0.100 TYP 8X 2.54 inch mm SCALE 2:1 Figure 5. SOP Footprint (Case 482) MPXV4115V Sensors Freescale Semiconductor 5 Transfer Function Nominal Transfer Value: Vout = VS (P x 0.007652) + 0.92) (Pressure Error x Temp. Factor x 0.007652 x VS) VS = 5 V 0.25 Vdc Temperature Error Band MPXV4115V Series 4.0 3.0 Temperature Error Factor 2.0 1.0 0.0 -40 -20 0 20 40 60 80 100 120 140 Temperature in C Temp -40 0 to 85 +125 Multiplier 3 1 3 NOTE: The Temperature Multiplier is a linear response from 0C to -40C and from 85C to 125C. Pressure Error Band 1.950 1.725 Pressure Error (kPa) 1.500 0 -1.500 -1.725 -1.950 Pressure -115 to 0 kPa Error (Max) 1.725 kPa -115 -100 -85 -60 -45 -30 -15 0 Pressure in kPa (below atmospheric) MPXV4115V 6 Sensors Freescale Semiconductor PACKAGE DIMENSIONS -A4 5 D 8 PL 0.25 (0.010) M TB S A S -BG 8 1 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION A AND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 (0.006). 5. ALL VERTICAL SURFACES 5 TYPICAL DRAFT. INCHES MIN MAX 0.415 0.425 0.415 0.425 0.212 0.230 0.038 0.042 0.100 BSC 0.002 0.010 0.009 0.011 0.061 0.071 0 7 0.405 0.415 0.709 0.725 MILLIMETERS MIN MAX 10.54 10.79 10.54 10.79 5.38 5.84 0.96 1.07 2.54 BSC 0.05 0.25 0.23 0.28 1.55 1.80 0 7 10.29 10.54 18.01 18.41 S N C H -TPIN 1 IDENTIFIER SEATING PLANE J K M DIM A B C D G H J K M N S CASE 482-01 ISSUE O SMALL OUTLINE PACKAGE -A4 5 D 8 PL 0.25 (0.010) M TB S A S N -BG 8 1 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION A AND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 (0.006). 5. ALL VERTICAL SURFACES 5 TYPICAL DRAFT. INCHES MIN MAX 0.415 0.425 0.415 0.425 0.500 0.520 0.038 0.042 0.100 BSC 0.002 0.010 0.009 0.011 0.061 0.071 0 7 0.444 0.448 0.709 0.725 0.245 0.255 0.115 0.125 MILLIMETERS MIN MAX 10.54 10.79 10.54 10.79 12.70 13.21 0.96 1.07 2.54 BSC 0.05 0.25 0.23 0.28 1.55 1.80 0 7 11.28 11.38 18.01 18.41 6.22 6.48 2.92 3.17 S W V C H J K M PIN 1 IDENTIFIER -TSEATING PLANE DIM A B C D G H J K M N S V W CASE 482A-01 ISSUE A SMALL OUTLINE PACKAGE MPXV4115V Sensors Freescale Semiconductor 7 How to Reach Us: Home Page: www.freescale.com E-mail: support@freescale.com USA/Europe or Locations Not Listed: Freescale Semiconductor Technical Information Center, CH370 1300 N. Alma School Road Chandler, Arizona 85224 +1-800-521-6274 or +1-480-768-2130 support@freescale.com Europe, Middle East, and Africa: Freescale Halbleiter Deutschland GmbH Technical Information Center Schatzbogen 7 81829 Muenchen, Germany +44 1296 380 456 (English) +46 8 52200080 (English) +49 89 92103 559 (German) +33 1 69 35 48 48 (French) support@freescale.com Japan: Freescale Semiconductor Japan Ltd. Headquarters ARCO Tower 15F 1-8-1, Shimo-Meguro, Meguro-ku, Tokyo 153-0064 Japan 0120 191014 or +81 3 5437 9125 support.japan@freescale.com Asia/Pacific: Freescale Semiconductor Hong Kong Ltd. Technical Information Center 2 Dai King Street Tai Po Industrial Estate Tai Po, N.T., Hong Kong +800 2666 8080 support.asia@freescale.com For Literature Requests Only: Freescale Semiconductor Literature Distribution Center P.O. Box 5405 Denver, Colorado 80217 1-800-441-2447 or 303-675-2140 Fax: 303-675-2150 LDCForFreescaleSemiconductor@hibbertgroup.com Information in this document is provided solely to enable system and software implementers to use Freescale Semiconductor products. There are no express or implied copyright licenses granted hereunder to design or fabricate any integrated circuits or integrated circuits based on the information in this document. Freescale Semiconductor reserves the right to make changes without further notice to any products herein. Freescale Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does Freescale Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation consequential or incidental damages. "Typical" parameters that may be provided in Freescale Semiconductor data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including "Typicals", must be validated for each customer application by customer's technical experts. Freescale Semiconductor does not convey any license under its patent rights nor the rights of others. Freescale Semiconductor products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the Freescale Semiconductor product could create a situation where personal injury or death may occur. Should Buyer purchase or use Freescale Semiconductor products for any such unintended or unauthorized application, Buyer shall indemnify and hold Freescale Semiconductor and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that Freescale Semiconductor was negligent regarding the design or manufacture of the part. FreescaleTM and the Freescale logo are trademarks of Freescale Semiconductor, Inc. All other product or service names are the property of their respective owners. (c) Freescale Semiconductor, Inc. 2005. All rights reserved. MPXV4115V Rev. 2 05/2005 |
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